US 12,253,892 B2
Lid carveouts for processor connection and alignment
Jerry Anton Ahrens, Sister Bay, WI (US); William Robert Alverson, Del Valle, TX (US); Amitabh Mehra, Fort Collins, CO (US); Grant Evan Ley, Eden, UT (US); Anil Harwani, Austin, TX (US); and Joshua Taylor Knight, Georgetown, TX (US)
Assigned to Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed by Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed on Mar. 25, 2022, as Appl. No. 17/704,912.
Prior Publication US 2023/0315171 A1, Oct. 5, 2023
Int. Cl. G06F 1/20 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/206 (2013.01) [H05K 5/0213 (2013.01); H05K 5/03 (2013.01); H05K 7/20209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A processing device comprising:
a substrate including at least one processor core and one or more contacts configured to establish an electrical connection with the at least one processor core; and
an integrated heat spreader that is bonded to the substrate and covers the at least one processor core, the integrated heat spreader including:
a plurality of carveouts that expose at least one contact of the one or more contacts, the plurality of carveouts configured to receive a plurality of protrusions of a cooling device to mechanically align the cooling device with the processing device;
a first surface facing the at least one processor core; and
a second surface disposed opposite the first surface, the second surface contacting the cooling device to transfer heat away from the at least one processor core.