US 12,253,838 B2
Information processing device, recording medium, and process condition search method
Yuto Noda, Nirasaki (JP); Shota Yamazaki, Nirasaki (JP); Yuichi Takenaga, Nirasaki (JP); and Toshiyuki Fukumoto, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 26, 2022, as Appl. No. 17/584,712.
Claims priority of application No. 2021-016352 (JP), filed on Feb. 4, 2021.
Prior Publication US 2022/0244685 A1, Aug. 4, 2022
Int. Cl. G05B 13/04 (2006.01); G05B 13/02 (2006.01); G05B 23/02 (2006.01)
CPC G05B 13/042 (2013.01) [G05B 13/0265 (2013.01); G05B 23/0235 (2013.01); G05B 23/0262 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A system comprising:
an analysis server, which creates a machine learning model of a semiconductor manufacturing device executing a process according to a process condition and searches for a process condition that can achieve a target process result by using the machine learning model, the analysis server comprising:
a machine learning model selector configured to select a machine learning model among a plurality of machine learning models created by using a plurality of regression methods;
a calculator configured to perform an optimization calculation by using the selected machine learning model to calculate a plurality of process conditions that can achieve the target process result, predicted values of a process result corresponding to each of the plurality of process conditions, and reliability of the predicted values;
a process condition selector configured to select, among the plurality of the process conditions that can achieve the target process result, one or more process conditions according to the predicted values of the process result and the reliability of the predicted values; and
a display controller configured to display the selected process conditions, the predicted values of the process result corresponding to each of the selected process conditions, and the reliability of the predicted values,
wherein the process condition selector is further configured to select the one or more process conditions among the plurality of process conditions that can achieve the target process result, based on priorities assigned to a plurality of target values included in the target process result, priorities assigned to a plurality of adjustment targets, which is included in the process conditions and to be adjusted in order to achieve the target process result, and achievement levels of the predicted values with respect to the target values of the process result; and
a device controller configured to:
control the semiconductor manufacturing device to execute the process according to each of the selected process conditions.