US 12,253,727 B2
Electronic device
Chun-Hung Kuo, Taoyuan (TW); and Tzu-Hsuan Wang, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Nov. 15, 2022, as Appl. No. 17/987,770.
Claims priority of provisional application 63/326,285, filed on Apr. 1, 2022.
Claims priority of application No. 111124703 (TW), filed on Jul. 1, 2022.
Prior Publication US 2023/0314738 A1, Oct. 5, 2023
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 25/16 (2023.01); H04B 10/80 (2013.01)
CPC G02B 6/4214 (2013.01) [G02B 6/4266 (2013.01); G02B 6/43 (2013.01); H01L 25/167 (2013.01); H04B 10/801 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
at least one light-emitting element;
at least one IC chip configured to control the at least one light-emitting element to emit an optical signal;
a substrate, wherein the at least one light-emitting element is disposed on a first surface of the substrate, and the at least one IC chip is disposed on a second surface of the substrate; and
an optical waveguide layer disposed on the first surface of the substrate, and the optical waveguide layer comprises:
a core layer;
a cladding layer; and
a metal layer disposed on at least a portion of an interface between the core layer and the cladding layer;
at least one optical signal outlet corresponding to the at least one light-emitting element, and the optical signal reaches the at least one optical signal outlet after being transmitted in the core layer,
wherein a portion of the metal layer surrounds sidewalls of the at least one light-emitting element.