US 12,253,722 B2
Magneto-optical Kerr effect interconnects for photonic packaging
Hiroki Tanaka, Gilbert, AZ (US); Kristof Darmawikarta, Chandler, AZ (US); Brandon Marin, Gilbert, AZ (US); Robert May, Chandler, AZ (US); and Sri Ranga Sai Boyapati, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 24, 2021, as Appl. No. 17/357,788.
Prior Publication US 2022/0413233 A1, Dec. 29, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 5/30 (2006.01); G02B 27/12 (2006.01)
CPC G02B 6/4204 (2013.01) [G02B 6/4244 (2013.01); G02B 5/3033 (2013.01); G02B 27/126 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An optical package, comprising:
an optical die electrically coupled to a package substrate;
an optical interconnect adjacent the optical die, the optical interconnect comprising:
a first polarizing filter adjacent to a first lens;
a second polarizing filter adjacent to a second lens; and
a film comprising a magnetic material between the first polarizing filter and the second polarizing filter, the second polarizing filter rotated with respect to the first polarizing filter and the magnetic material to rotate a polarization vector of incoming light to the optical interconnect; and
an optical fiber interface port immediately adjacent to the first lens, wherein the second lens is immediately adjacent to an optical interface of the optical die.