US 12,253,714 B2
Etched facet in a multi quantum well structure
Paveen Apiratikul, Albuquerque, NM (US); and Damien Lambert, Los Altos, NM (US)
Assigned to Skorpios Technologies, Inc., Albuquerque, NM (US)
Filed by Skorpios Technologies, Inc., Albuquerque, NM (US)
Filed on Mar. 6, 2023, as Appl. No. 18/179,167.
Application 18/179,167 is a continuation of application No. 17/539,474, filed on Dec. 1, 2021, granted, now 11,624,872.
Application 17/539,474 is a continuation of application No. 16/690,483, filed on Nov. 21, 2019, granted, now 11,194,092.
Claims priority of provisional application 62/770,532, filed on Nov. 21, 2018.
Prior Publication US 2023/0358951 A1, Nov. 9, 2023
Int. Cl. G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/136 (2006.01)
CPC G02B 6/12004 (2013.01) [G02B 6/122 (2013.01); G02B 6/136 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12128 (2013.01); G02B 6/1225 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A device comprising:
a platform, wherein the platform comprises a first semiconductor material; and
a chip, wherein:
the chip comprises a second semiconductor material;
the chip is positioned on the platform; and
the chip comprises:
a side;
a waveguide;
an etched facet at least partially defining a recess in the side of the chip and arranged to couple light in to or out of the waveguide; and
a contact metal disposed on the chip at a predetermined distance from the etched facet.