US 12,253,639 B2
Sensor board, radiation imaging apparatus, radiation imaging system, and method of manufacturing sensor board
Masao Ina, Kanagawa (JP); Takamasa Ishii, Saitama (JP); Masato Ofuji, Gunma (JP); and Katsuro Takenaka, Saitama (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Feb. 2, 2023, as Appl. No. 18/163,432.
Claims priority of application No. 2022-020793 (JP), filed on Feb. 14, 2022.
Prior Publication US 2023/0258834 A1, Aug. 17, 2023
Int. Cl. G01T 3/06 (2006.01)
CPC G01T 3/06 (2013.01) 19 Claims
OG exemplary drawing
 
1. A sensor board comprising:
a substrate comprising a pixel region where a plurality of pixels are arranged on a first principal surface of two principal surfaces;
a scintillator arranged on one of the first principal surface and a second principal surface of the two principal surfaces; and
a light shielding member arranged on the principal surface of the two principal surfaces on which the scintillator is arranged,
wherein the pixel region comprises a first region where pixels among the plurality of pixels, each of which generates a signal corresponding to each pixel of a radiation image, are arranged, and a second region where pixels among the plurality of pixels, each of which generates a signal for correcting a signal output from the first region, are arranged,
the scintillator is arranged so as to overlap the first region but not to overlap the second region in an orthogonal projection with respect to the first principal surface,
the light shielding member is arranged so as to cover the scintillator and overlap the second region in the orthogonal projection with respect to the first principal surface, and
a portion of the light shielding member overlapping the second region is bonded to the principal surface of the two principal surfaces on which the scintillator is arranged.