US 12,253,559 B2
Alignment method and inspection apparatus
Shinjiro Watanabe, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on May 18, 2022, as Appl. No. 17/747,867.
Claims priority of application No. 2021-091638 (JP), filed on May 31, 2021.
Prior Publication US 2022/0381820 A1, Dec. 1, 2022
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2887 (2013.01) 7 Claims
OG exemplary drawing
 
1. An inspection apparatus comprising:
a substrate support on which a substrate is placed;
a probe card including a plurality of probe groups provided to respectively correspond to a plurality of chips formed on the substrate, wherein each of the plurality of chips includes electrode pads, and each of the plurality of probe groups includes probes that correspond to the electrode pads of each of the plurality of chips;
a camera for detecting positions of the probes; and
a controller,
wherein the controller is configured to perform a first mode for:
calculating a probe group vector of the probe group based on position information of two or more probes included in the probe group for each of the plurality of chips, wherein the position information is obtained by imaging the probe card using the camera,
calculating a probe group center of the probe group based on the position information of two or more probes included in the probe group for each of the plurality of chips,
calculating a probe card center of the probe card based on the calculated probe group centers of the plurality of probe groups,
calculating a probe card vector of the probe card based on the calculated probe group vectors of the plurality of probe groups,
calculating a deviation amount of the calculated probe card vector with respect to a designed probe card vector and a deviation amount of the calculated probe card center with respect to a designed probe card center; and
aligning the electrode pads of the chips with the probes of the probe groups based on the calculated deviation amount of the probe card vector and the calculated deviation amount of the probe card center.