US 12,253,476 B2
Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system
Dermot Cantwell, Sunnyvale, CA (US); Quentin Ernie Walker, Fremont, CA (US); Serghei Malkov, Hayward, CA (US); and Jatinder Kumar, Milpitas, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 12, 2024, as Appl. No. 18/411,609.
Application 18/411,609 is a continuation of application No. 18/100,518, filed on Jan. 23, 2023, granted, now 11,874,234.
Application 18/100,518 is a continuation of application No. 17/547,117, filed on Dec. 9, 2021, granted, now 11,585,764, issued on Feb. 21, 2023.
Prior Publication US 2024/0151656 A1, May 9, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 22/00 (2006.01); G01N 22/02 (2006.01); G01N 22/04 (2006.01); G01R 27/06 (2006.01); G01R 27/28 (2006.01); G01R 27/32 (2006.01)
CPC G01N 22/00 (2013.01) [G01N 22/02 (2013.01); G01N 22/04 (2013.01); G01R 27/06 (2013.01); G01R 27/28 (2013.01); G01R 27/32 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
receiving, from one or more sensors associated with a processing chamber, sensor data indicative of a radio frequency (RF) pulse waveform detected within the processing chamber;
identifying one or more RF signal characteristics in the detected RF pulse waveform, wherein each of the identified one or more RF signal characteristics corresponds to at least one RF signal pulse of an RF signal pulsing within the processing chamber;
determining, based on the identified one or more RF signal characteristics, whether the detected RF pulse waveform corresponds to a target RF pulse waveform; and
providing, to a client device associated with the processing chamber, an indication of whether the detected RF pulse waveform corresponds to the target RF pulse waveform.