US 12,253,449 B2
Physical property measurement method, physical property measurement device, and probe
Tadashi Kajiya, Kanagawa (JP); Daisuke Sawai, Kanagawa (JP); Koji Miyata, Kanagawa (JP); and Hiroyuki Noda, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Oct. 31, 2022, as Appl. No. 18/051,012.
Application 18/051,012 is a continuation of application No. PCT/JP2021/015901, filed on Apr. 19, 2021.
Claims priority of application No. 2020-081131 (JP), filed on May 1, 2020.
Prior Publication US 2023/0106219 A1, Apr. 6, 2023
Int. Cl. G01N 11/00 (2006.01); G01N 11/10 (2006.01); G01N 13/02 (2006.01)
CPC G01N 11/10 (2013.01) [G01N 13/02 (2013.01); G01N 2013/0283 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A physical property measurement method comprising:
a step of bringing a probe into contact with a surface layer portion of a liquid or gel-like object and maintaining a contact state;
a step of measuring a height of the object rising along the probe in contact with the object; and
a step of calculating a viscosity or an elastic property of the surface layer portion of the object using the measured height of the object rising along the probe and based on one of the following expressions:

OG Complex Work Unit Math
where σ represents a surface tension of the object, G represents a shear modulus of the surface layer portion of the object, R represents a diameter of a tip portion of the probe at the height of the object rising along the probe, h represents the height of the object as measured, κ represents a meniscus curvature of the surface layer portion of the object, η represents the viscosity, and t represents time in seconds.