US 12,253,423 B2
Thermal sensor integration for system temperature management
Shai Cohen, Haifa (IL); Amihai Moshe Kopel, Binyamina (IL); Beeri Halachmi, Kefar Sava (IL); and Alexander Kaminsky, Kiryat Bialik (IL)
Assigned to Mellanox Technologies, Ltd., Yokneam (IL)
Filed by Mellanox Technologies, Ltd., Yokneam (IL)
Filed on Apr. 26, 2022, as Appl. No. 17/729,328.
Claims priority of provisional application 63/313,826, filed on Feb. 25, 2022.
Prior Publication US 2023/0273072 A1, Aug. 31, 2023
Int. Cl. G01K 3/06 (2006.01); G01K 1/02 (2021.01); G01K 3/00 (2006.01); G01K 7/00 (2006.01)
CPC G01K 3/06 (2013.01) [G01K 1/026 (2013.01); G01K 3/005 (2013.01); G01K 7/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a memory device; and
a processing device, operatively coupled to the memory device, to perform operations comprising:
receiving, from a thermal sensor group comprising a plurality of thermal sensors, a plurality of hotspot temperature measurements with respect to a hotspot, each hotspot temperature measurement of the plurality of hotspot temperature measurements being received from a respective thermal sensor of the plurality of thermal sensors, wherein each hotspot temperature measurement of the plurality of hotspot temperature measurements is based on a temperature measurement received from the respective thermal sensor, and a thermal offset of the respective thermal sensor; and
determining, from the plurality of hotspot temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.