US 12,252,784 B2
Copper halide layers
Christina M. Chang, Cambridge, MA (US); Luke M. Davis, Cambridge, MA (US); and Roy Gerald Gordon, Cambridge, MA (US)
Assigned to President and Fellows of Harvard College, Cambridge, MA (US)
Appl. No. 17/618,217
Filed by President and Fellows of Harvard College, Cambridge, MA (US)
PCT Filed Jun. 12, 2020, PCT No. PCT/US2020/037537
§ 371(c)(1), (2) Date Dec. 10, 2021,
PCT Pub. No. WO2020/252342, PCT Pub. Date Dec. 17, 2020.
Claims priority of provisional application 62/860,579, filed on Jun. 12, 2019.
Prior Publication US 2022/0380893 A1, Dec. 1, 2022
Int. Cl. C23C 16/30 (2006.01); C01G 3/05 (2006.01); C23C 16/02 (2006.01); H01G 9/20 (2006.01); H10K 30/40 (2023.01); H10K 102/00 (2023.01)
CPC C23C 16/30 (2013.01) [C01G 3/05 (2013.01); C23C 16/0272 (2013.01); H01G 9/20 (2013.01); H10K 30/40 (2023.02); H10K 2102/00 (2023.02)] 36 Claims
OG exemplary drawing
 
1. An article comprising:
a substrate; and
a copper halide layer on the substrate;
wherein the interfacial free energy between the substrate and the copper halide layer is configured such that:
the copper halide layer is free of discontinuations of sizes of about 5 nm2 or greater; and
the copper halide layer conforms to the shape of the substrate.