	US 12,252,634 B2
	Polyurethane for polishing layers, polishing layer and polishing pad
Mitsuru Kato, Kurashiki (JP); Chihiro Okamoto, Kurashiki (JP); and Shinya Kato, Tokyo (JP)
Assigned to KURARAY CO., LTD., Kurashiki (JP)
Appl. No. 17/288,579
Filed by KURARAY CO., LTD., Kurashiki (JP)
PCT Filed Sep. 3, 2019, PCT No. PCT/JP2019/034512 § 371(c)(1), (2) Date Apr. 26, 2021, PCT Pub. No. WO2020/115968, PCT Pub. Date Jun. 11, 2020.
Claims priority of application No. 2018-226291 (JP), filed on Dec. 3, 2018.
Prior Publication US 2021/0388234 A1, Dec. 16, 2021
Int. Cl. C08G 18/28 (2006.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C09G 1/16 (2006.01)

CPC C09G 1/16 (2013.01) [B24B 37/22 (2013.01); B24B 37/24 (2013.01); C08G 18/283 (2013.01); C08G 18/2835 (2013.01); C08G 18/4825 (2013.01); C08G 18/7671 (2013.01)]

14 Claims

1. A polishing layer that is a molded body of a polyurethane comprising:

a terminal group represented by formula (I):

R—(OX)_n— (I)

wherein

R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that are optionally substituted with a heteroatom or are optionally interrupted by a heteroatom,

X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and

n represents a number from 8 to 120.