US 12,252,633 B2
Polishing liquid and method for manufacturing glass substrate
Toshio Takizawa, Akishima (JP)
Assigned to HOYA CORPORATION, Tokyo (JP)
Filed by HOYA CORPORATION, Tokyo (JP)
Filed on May 22, 2023, as Appl. No. 18/321,385.
Application 18/321,385 is a continuation of application No. 17/566,200, filed on Dec. 30, 2021, granted, now 11,680,187.
Application 17/566,200 is a continuation of application No. 16/641,185, granted, now 11,214,713, issued on Jan. 4, 2022, previously published as PCT/JP2018/040610, filed on Oct. 31, 2018.
Claims priority of application No. 2017-210817 (JP), filed on Oct. 31, 2017.
Prior Publication US 2023/0287244 A1, Sep. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. C09G 1/02 (2006.01); B24B 7/24 (2006.01); C03C 17/00 (2006.01); C09K 3/14 (2006.01); G11B 5/73 (2006.01); G11B 5/84 (2006.01)
CPC C09G 1/02 (2013.01) [B24B 7/241 (2013.01); B24B 7/245 (2013.01); C03C 17/002 (2013.01); C09K 3/1454 (2013.01); G11B 5/73921 (2019.05); G11B 5/8404 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A polishing liquid that contains cerium oxide as loose abrasive particles and is to be used in polishing processing for polishing a surface of a glass substrate,
wherein, letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of a total particle volume in a particle size distribution obtained regarding the cerium oxide using a laser diffraction/scattering method,
D5 is 1 μm or less,
a difference between D95 and the D5 is 3 μm or more,
D50 is 0.8 to 2.4 μm, and
Dpeak−D5 is less than D95−Dpeak, where the Dpeak is a particle diameter at which a frequency is at a maximum in the particle size distribution.