US 12,252,627 B2
Photosensitive resin composition, film prepared from the same, and electronic apparatus including the film
Sunghwan Hong, Yongin-si (KR); Beomsoo Shin, Yongin-si (KR); Sukhoon Kang, Yongin-si (KR); Jeongsoo Kim, Yongin-si (KR); Jongmin Ok, Yongin-si (KR); and Minseok Lee, Yongin-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Jun. 1, 2022, as Appl. No. 17/805,008.
Claims priority of application No. 10-2021-0071474 (KR), filed on Jun. 2, 2021; and application No. 10-2022-0057389 (KR), filed on May 10, 2022.
Prior Publication US 2022/0403179 A1, Dec. 22, 2022
Int. Cl. C09D 4/00 (2006.01); C08F 220/06 (2006.01); H10K 59/122 (2023.01); H10K 59/38 (2023.01)
CPC C09D 4/00 (2013.01) [C08F 220/06 (2013.01); H10K 59/122 (2023.02); H10K 59/38 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A photosensitive resin composition comprising:
a first unit comprising one or more acryloyl groups;
a second unit comprising one or more epoxy groups;
a third unit comprising one or more hydrophilic groups; and
a solvent,
wherein a ratio of the equivalent weight of the acryloyl groups of the first unit to the equivalent weight of the epoxy groups of the second unit is 2:1 or more.