US 12,252,616 B2
Curable silicone composition, encapsulant and optical semiconductor device
Sawako Horie, Chiba (JP); Kasumi Takeuchi, Chiba (JP); Shunya Takeuchi, Chiba (JP); Hyunji Kang, Gyeonggi-Do (KR); and Akihiko Kobayashi, Chiba (JP)
Assigned to Dupont Toray Specialty Materials Kabushiki Kaisha, Tokyo (JP); and DuPont Specialty Materials Korea Ltd., Chenonan-si (KR)
Filed by DuPont Toray Specialty Materials Kabushiki Kaisha, Tokyo (JP); and DuPont Specialty Materials Korea Ltd., Cheonan-si (KR)
Filed on Dec. 16, 2021, as Appl. No. 17/644,623.
Claims priority of application No. 2020-219285 (JP), filed on Dec. 28, 2020.
Prior Publication US 2022/0204771 A1, Jun. 30, 2022
Int. Cl. C08L 83/06 (2006.01); C08G 77/00 (2006.01); C08G 77/12 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01); C08K 7/26 (2006.01); C08L 83/04 (2006.01); C09J 11/04 (2006.01); C09J 183/04 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01)
CPC C08L 83/06 (2013.01) [C08L 2205/025 (2013.01); C08L 2205/03 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A curable silicone composition comprising:
(A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule;
(C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I):
(R13SiO1/2)f(R22SiO2/2)g(R1SiO3/2)h(SiO4/2)i(XO1/2)j
wherein, in Formula (I),
R1 are, in each case, independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, wherein at least two R1 are alkenyl groups;
R2 are, in each case, independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R2 is an epoxy group-containing organic group;
X is a hydrogen atom or an alkyl group;
0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5;
0<j<0.5; f+g+h+i+j=1.0; h+i>0; and
j/(f+g+h+i+j)>0.05}; and
(D) a curing catalyst.