US 12,252,613 B1
Packaging film and preparation method thereof, and filter chip packaging method
De Wu, Wuhan (CN); Ting Li, Wuhan (CN); Shuhang Liao, Wuhan (CN); and Junxing Su, Wuhan (CN)
Assigned to WUHAN CHOICE TECHNOLOGY CO., LTD., Wuhan (CN)
Filed by WUHAN CHOICE TECHNOLOGY CO., LTD., Wuhan (CN)
Filed on Oct. 30, 2024, as Appl. No. 18/931,127.
Application 18/931,127 is a continuation of application No. PCT/CN2024/088248, filed on Apr. 17, 2024.
Claims priority of application No. 202311312691.4 (CN), filed on Oct. 11, 2023.
Int. Cl. C09J 163/00 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 5/315 (2006.01); C08K 5/357 (2006.01); C08K 7/18 (2006.01); C08L 71/10 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01)
CPC C08L 71/10 (2013.01) [C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 5/3155 (2013.01); C08K 5/357 (2013.01); C08K 7/18 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); C08J 2371/10 (2013.01)] 12 Claims
 
1. A packaging film, wherein raw materials of the packaging film comprise:
20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of a curing agent, 2-5 parts by mass of a photoinitiator, and 0.4-0.8 parts by mass of an accelerant; wherein the curing agent is compounded by a bisphenol F-based benzoxazine curing agent and a dicyandiamide curing agent according to a mass ratio of 10: (7-9).