US 12,252,396 B2
Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers
Christopher Murray Beard, Allen, TX (US); Song Zheng, Fairview, TX (US); John Wesley Hamlin, III, Dallas, TX (US); Win-Jae Jessie Yuan, Dallas, TX (US); Kelly Jay Taylor, Allen, TX (US); and Jose Antonio Martinez Soto, Murphy, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Apr. 25, 2022, as Appl. No. 17/728,844.
Claims priority of provisional application 63/271,743, filed on Oct. 26, 2021.
Claims priority of provisional application 63/271,749, filed on Oct. 26, 2021.
Prior Publication US 2023/0127477 A1, Apr. 27, 2023
Int. Cl. B81C 1/00 (2006.01)
CPC B81C 1/00396 (2013.01) [B81C 1/00523 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0176 (2013.01); B81C 2201/0181 (2013.01); B81C 2201/0198 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method, comprising:
depositing an organic polymer layer on one or more material layers;
thermally curing the organic polymer layer;
depositing a hard mask on the organic polymer layer;
depositing a photoresist layer on the hard mask;
patterning the photoresist layer to expose at least a portion of the hard mask;
etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer;
etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers to form an opening;
removing the hard mask; and
depositing a metal layer on the organic polymer layer and in the opening of the organic polymer layer.