US 12,251,936 B2
MEMS device, liquid ejecting head, and liquid ejecting apparatus
Motoki Takabe, Shiojiri (JP); and Yu Shiozawa, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jan. 18, 2023, as Appl. No. 18/098,157.
Claims priority of application No. 2022-006110 (JP), filed on Jan. 19, 2022.
Prior Publication US 2023/0226818 A1, Jul. 20, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/16 (2006.01); B81B 7/02 (2006.01)
CPC B41J 2/14233 (2013.01) [B41J 2/1606 (2013.01); B41J 2002/14306 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14475 (2013.01); B41J 2002/14491 (2013.01); B41J 2/162 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/164 (2013.01); B41J 2202/08 (2013.01); B81B 7/02 (2013.01); B81B 2201/052 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A MEMS device comprising:
a first substrate including a single-crystal silicon substrate; and
a second substrate including a single-crystal silicon substrate, the first substrate and the second substrate being laminated together, wherein
the first substrate and the second substrate are joined to each other such that a cleavage direction of the first substrate intersects a cleavage direction of the second substrate in a plan view; and
the cleavage directions of the first substrate and the second substrate are along cleavage surfaces of the single-crystal silicon substrates that are arranged orthogonal to a crystal plane of a surface of each of the first substrate and the second substrate in the plan view.