US 12,251,922 B2
Method for manufacturing electrical steel sheet product
Jung-Woo Kim, Pohang-si (KR); Bongwoo Ha, Pohang-si (KR); Taeyoung No, Pohang-si (KR); and Dong-Gyu Lee, Pohang-si (KR)
Assigned to POSCO CO., LTD, Pohang-si (KR)
Appl. No. 17/280,577
Filed by POSCO, Pohang-si (KR)
PCT Filed Sep. 24, 2019, PCT No. PCT/KR2019/012408
§ 371(c)(1), (2) Date Jun. 2, 2021,
PCT Pub. No. WO2020/067703, PCT Pub. Date Apr. 2, 2020.
Claims priority of application No. 10-2018-0116301 (KR), filed on Sep. 28, 2018.
Prior Publication US 2022/0001646 A1, Jan. 6, 2022
Int. Cl. B32B 7/12 (2006.01); B32B 7/025 (2019.01); B32B 15/01 (2006.01); B32B 37/08 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); C08K 3/22 (2006.01); C08K 3/32 (2006.01); C09J 163/00 (2006.01)
CPC B32B 7/12 (2013.01) [B32B 7/025 (2019.01); B32B 15/011 (2013.01); B32B 37/08 (2013.01); B32B 37/10 (2013.01); B32B 37/1207 (2013.01); B32B 37/1284 (2013.01); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C09J 163/00 (2013.01); B32B 2255/06 (2013.01); B32B 2307/20 (2013.01); C08K 2003/329 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing an electrical steel sheet product, the method comprising:
preparing an adhesive coating composition;
forming an adhesive coating layer by applying and then curing the adhesive coating composition onto a surface of an electrical steel sheet;
forming a heat-fused layer by laminating and heat-fusing a plurality of electrical steel sheets on which the adhesive coating layers are formed; and
cooling the heat-fused electrical steel sheets at a cooling rate of 0.05 to 20° C./min,
wherein:
in the cooling of the heat-fused electrical steel sheets at the cooling rate of 0.05 to 20° C./min,
a holding pressing force is 1,000 N/mm2 or less,
the adhesive coating composition contains an organic/inorganic complex and an inorganic substance,
the organic/inorganic complex comprises an organic resin and an inorganic nanoparticle,
the inorganic nanoparticle is at least partially substituted for a functional group of the organic resin,
the organic resin is a water-soluble epoxy resin,
the water-soluble epoxy resin is a multifunctional epoxy resin having three or more epoxy groups, and the water-soluble epoxy resin has a weight average molecular weight of 1,000 to 50,000, a softening temperature (Tg) of 70 to 120° C., and a solid fraction of 10 to 50 wt %,
the inorganic nanoparticle includes one or more of SiO2, TiO2, ZnO, Al2O3, MgO, CaO, and ZrO2, and
the inorganic substance is phosphoric acid (H3PO4) or sodium hydroxide (NaOH).