US 12,251,921 B2
Techniques for fabricating and separating flexible microelectronics devices from rigid substrates
Francis Zaato, Montreal (CA); Humaira Taz, Montreal (CA); Avinash Nanayakkara, Montreal (CA); and Harit Doshi, Montreal (CA)
Assigned to Omniply Technologies, Inc., Montreal (CA)
Filed by OMNIPLY TECHNOLOGIES INC., Montreal (CA)
Filed on Apr. 6, 2023, as Appl. No. 18/296,465.
Application 18/296,465 is a continuation of application No. PCT/CA2021/051388, filed on Oct. 5, 2021.
Claims priority of provisional application 63/088,133, filed on Oct. 6, 2020.
Claims priority of provisional application 63/088,150, filed on Oct. 6, 2020.
Prior Publication US 2023/0245913 A1, Aug. 3, 2023
Int. Cl. B32B 7/06 (2019.01); B32B 17/10 (2006.01)
CPC B32B 7/06 (2013.01) [B32B 17/10 (2013.01); B32B 2264/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laminate structure used in the manufacturing of electronics devices, the laminate structure comprising:
a rigid substrate;
a flexible microelectronics structure comprising:
at least one device layer; and
at least one flexible device substrate layer;
a debonding structure provided between the rigid substrate and the flexible microelectronics structure, the debonding structure comprising:
at least one debonding layer made of a non-metallic inorganic material,
the laminate structure comprising first and second peeling surfaces, at least one of the peeling surfaces corresponding to a surface of the debonding structure or to a surface within the debonding structure, the first and second peeling surfaces being peelable by a debonding force resulting from pressurized fluid delamination and/or from mechanical delamination applied during an initiation phase followed by a delamination phase, whereby:
the initiation phase comprises a debonding force of more than 40 gF, and the delamination phase comprises a debonding force of less than 30 gF, thereby allowing separating the flexible microelectronic device from the rigid substrate.