US 12,251,785 B2
Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit
EdwardLiCang Lee, Zhejiang (CN); and Jingran Gu, Zhejiang (CN)
Assigned to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC., Zhejiang (CN)
Appl. No. 17/274,183
Filed by HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC., Zhejiang (CN)
PCT Filed Aug. 20, 2019, PCT No. PCT/CN2019/101581
§ 371(c)(1), (2) Date Mar. 7, 2021,
PCT Pub. No. WO2020/048311, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 201811043848.7 (CN), filed on Sep. 7, 2018; application No. 201811466539.0 (CN), filed on Dec. 3, 2018; and application No. 201910481448.2 (CN), filed on Jun. 4, 2019.
Prior Publication US 2021/0260716 A1, Aug. 26, 2021
Int. Cl. B24B 29/02 (2006.01); B24B 37/30 (2012.01); B24B 37/34 (2012.01); B24B 41/06 (2012.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01)
CPC B24B 29/02 (2013.01) [B24B 37/30 (2013.01); B24B 37/345 (2013.01); B24B 41/06 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A chemical-mechanical planarization equipment, comprising a polishing module, cleaning modules, polishing transfer stations and a wafer transfer module, wherein the cleaning modules are used for cleaning polished wafers, characterized in that, the polishing module includes two rows of polishing unit arrays, each containing two or more sets of polishing units; wherein polishing transfer stations correspond to the two rows of polishing unit arrays and are longitudinally arranged in a row direction of the polishing unit arrays; the cleaning modules are arranged in two rows, corresponding to the two rows of polishing unit arrays; a working area of the wafer transfer module, is located vertically above the polishing transfer stations that are longitudinally arranged, and performs wafer transfer among a loading/unloading area and the polishing transfer stations, and the working area is between the polishing transfer stations,
wherein, the wafer transfer module includes a first wafer transfer unit and a second wafer transfer unit, the first wafer transfer unit and the second wafer transfer unit share a guide device, each of the first wafer transfer unit and the second wafer transfer unit comprises a horizontal actuator, a vertical drive, a wafer chuck, and a wafer clamp; the horizontal actuator drives the vertical drive to slide along the guide device horizontally; the vertical drive connected with the wafer chuck, and controls the wafer chuck to work in two modes of a high position and a low position; the wafer clamp is installed on the wafer chuck, and performs opening and closing actions, and
wherein the guide device extends along a first direction, and includes a first region, a middle area and a second region connected in sequence along the first direction, wherein the middle area is sandwiched in between the first region and the second region;
wherein the horizontal actuator of the first wafer transfer unit extends along the first direction on a first side of the guide device, and is arranged in parallel with the first region and the middle area of the guide device, and terminates in the middle area, and the horizontal actuator of the second wafer transfer unit extends along the first direction on a second side of the guide device, and is arranged in parallel with the second region and the middle area of the guide device, and terminates in the middle area, and the horizontal actuator of the first wafer transfer unit and the horizontal actuator of the second wafer transfer unit has a movable overlap only at the middle area of the guide device along the first direction.