	US 12,251,701 B2
	Fluid thermal processing
Hilary Ely, Corvallis, OR (US); Michael W. Cumbie, Corvallis, OR (US); Adam Higgins, Corvallis, OR (US); Rachel M. White, Corvallis, OR (US); and Erik D. Torniainen, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 16/768,881
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
PCT Filed Oct. 3, 2018, PCT No. PCT/US2018/054265 § 371(c)(1), (2) Date Jun. 2, 2020, PCT Pub. No. WO2019/143392, PCT Pub. Date Jul. 25, 2019.
Application 16/768,881 is a continuation in part of application No. PCT/US2018/013848, filed on Jan. 16, 2018.
Prior Publication US 2020/0368750 A1, Nov. 26, 2020
Int. Cl. C12P 19/34 (2006.01); B01L 3/00 (2006.01); B01L 7/00 (2006.01)

CPC B01L 7/52 (2013.01) [B01L 3/50273 (2013.01); C12P 19/34 (2013.01); B01L 2300/04 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/0809 (2013.01); B01L 2300/18 (2013.01); B01L 2400/0406 (2013.01)]

20 Claims

1. A fluid thermal processing device comprising:

a substrate;

a platform projecting from the substrate;

a fluid heating element supported by the platform;

a temperature sensing element, distinct from the fluid heating element, supported by the platform; and

an enclosure supported by the substrate and cooperating with the substrate to form a fluid chamber of uniform thickness around the platform, wherein the platform, the fluid heating element, and the temperature sensing element are exposed to the fluid chamber.