US 12,251,081 B2
Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes
Teng-Sheng Chen, Hsinchu (TW); Wei-Ping Chen, New Taipei (TW); Wei-Feng Lin, Hsinchu (TW); and Jau-Jan Deng, Taipei (TW)
Assigned to OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed by OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed on May 18, 2022, as Appl. No. 17/747,803.
Application 17/747,803 is a continuation in part of application No. 17/504,105, filed on Oct. 18, 2021, granted, now 12,064,090.
Prior Publication US 2023/0118866 A1, Apr. 20, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/06 (2006.01)
CPC A61B 1/051 (2013.01) [A61B 1/00096 (2013.01); A61B 1/0638 (2013.01); A61B 1/0684 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A cavity interposer having a body configured with a cavity, the body comprising:
a plurality of first bondpads adapted to couple to bondpads of a chip-type camera cube (CCube), the first bondpads disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the cavity interposer at a second level; and
a plurality of third bondpads adapted to couple to bondpads of an light-emitting diode (LED), the third bondpads disposed at a third level;
the third bondpads coupled through feedthroughs to fourth bondpads at the base of the cavity interposer at the second level;
the second and fourth bondpads adapted to couple to conductors of a cable; and the first, second, and third level are different.