	US 11,930,620 B2
	Vapor chambers
Jeff Ku, Taipei (TW); Cora Nien, Changhua County (TW); Gavin Sung, Taichung (TW); Tim Liu, New Taipei (TW); Lance Lin, New Taipei (TW); Wan Yu Liu, New Taipei (TW); Gerry Juan, Taipei (TW); Jason Y. Jiang, Taipei (TW); Justin M. Huttula, Portland, OR (US); Evan Piotr Kuklinski, North Plains, OR (US); Juha Tapani Paavola, Hillsboro, OR (US); Arnab Sen, Bangalore (IN); Hari Shanker Thakur, Bangalore (IN); and Prakash Kurma Raju, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 27, 2020, as Appl. No. 16/914,294.
Prior Publication US 2020/0396864 A1, Dec. 17, 2020
Int. Cl. G06F 1/20 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01)

CPC H05K 7/20309 (2013.01) [G06F 1/203 (2013.01); H01L 23/427 (2013.01); H05K 7/20136 (2013.01); H05K 7/20336 (2013.01)]

11 Claims

1. A heat dissipator for an electronic apparatus, comprising:

a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension (d₂) of the rectangular form factor is at least twice a first dimension (d₁) of the rectangular form factor;

a first fan located adjacent to a d₂edge of the planar vapor chamber and proximate to a first d₁edge of the planar vapor chamber;

a second fan located adjacent to the d₂edge of the planar vapor chamber and proximate to a second d₁edge of the planar vapor chamber, wherein the second d₁edge of the planar vapor chamber is opposite the first d₁edge of the planar vapor chamber;

a first heat pipe discrete from the planar vapor chamber and located along the first d₁edge of the planar vapor chamber, wherein the first heat pipe is disposed to conduct heat from the first d₁edge of the planar vapor chamber to the first fan; and

a second heat pipe discrete from the planar vapor chamber and located along the second d₁edge of the planar vapor chamber, wherein the second heat pipe is disposed to-conduct heat from the second d₁edge of the planar vapor chamber to the second fan.