CPC H05K 1/0373 (2013.01) [C09J 11/06 (2013.01); C09J 153/02 (2013.01); C09J 171/12 (2013.01); C09J 179/085 (2013.01); C09J 2203/326 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0195 (2013.01)] | 16 Claims |
1. A circuit material, comprising a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged between the conductive metal layer and the dielectric substrate layer,
wherein the adhesive layer is made of a material which comprises an adhesive composition; wherein the adhesive composition comprises a resin component and a non-resin component;
wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator;
the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing;
wherein the SBS resin has a number average molecular weight of 5,000-50,000, the SBS resin has a side chain vinyl content of 60-99 mol. %, the SBS resin has a styrene unit content of 35-55 mol. %;
wherein the circuit material obtained by curing the dielectric circuit substrate layer and the adhesive layer has dielectric constant at 1-10 GHz of 3.36 to 3.68, and dielectric loss factor of 0.0029-0.0038; and
wherein the adhesive layer has a grammage of 2-40 g/m2.
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