US 11,929,564 B2
Electronic device comprising 5G antenna
Seungmin Woo, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/773,008
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Oct. 30, 2019, PCT No. PCT/KR2019/014421
§ 371(c)(1), (2) Date Apr. 28, 2022,
PCT Pub. No. WO2021/085669, PCT Pub. Date May 6, 2021.
Prior Publication US 2022/0407233 A1, Dec. 22, 2022
Int. Cl. H01Q 9/06 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 5/385 (2015.01); H01Q 21/06 (2006.01); H01Q 23/00 (2006.01); H04B 1/40 (2015.01); H04B 7/0413 (2017.01); H04B 7/06 (2006.01)
CPC H01Q 9/065 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 5/385 (2015.01); H01Q 21/062 (2013.01); H01Q 23/00 (2013.01); H04B 1/40 (2013.01); H04B 7/0413 (2013.01); H04B 7/0617 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device having an antenna, the electronic device comprising:
an array antenna implemented as a multi-layer substrate inside the electronic device, the array antenna comprising a plurality of antenna elements; and
a transceiver circuit that controls a signal applied to each antenna element of the array antenna to perform beamforming through the array antenna,
wherein each of the antenna elements comprises:
a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna comprising a first patch and a second patch spaced apart from each other by a predetermined spacing; and
a ground layer disposed under the patch antenna, the ground layer having a slot, and
wherein the first patch and the second patch are connected to the ground layer through a plurality of vias, and the plurality of vias are disposed in a length direction of the slot to be adjacent to the slot.