CPC H01M 10/0525 (2013.01) [H01M 50/403 (2021.01); H01M 50/443 (2021.01); H01M 50/446 (2021.01); H01M 50/451 (2021.01); H01M 50/457 (2021.01); H01M 50/489 (2021.01); H01M 50/491 (2021.01)] | 14 Claims |
1. A method for manufacturing a separator for an electrochemical device, which comprises:
(S1) preparing a slurry for forming an inorganic coating layer, the slurry comprising a solvent, inorganic particles and a binder resin;
(S2) applying the slurry for forming the inorganic coating layer to at least one surface of a porous substrate; and
(S3) dipping the porous substrate coated with the inorganic coating layer in a solidifying solution containing a non-solvent,
wherein the binder resin in the slurry comprises a vinylidene fluoride homopolymer or a copolymer of vinylidene fluoride with another copolymerizable monomer in an amount of 90 wt % or more based on 100 wt % of the binder resin, the vinylidene fluoride homopolymer or the copolymer of vinylidene fluoride with another copolymerizable monomer has a weight average molecular weight of 400,000 or less and a melting point of 140° C. or less,
wherein a weight ratio of the binder resin to the inorganic particles in the slurry is at 30:70 to 60:40,
wherein the dipping is carried out once, or twice or more, and an initial solidifying solution temperature is controlled to a temperature equal to or higher than 5° C. and less than 20° C.
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