US 11,929,358 B2
Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device
Zhiwei Liang, Beijing (CN); Wenqian Luo, Beijing (CN); Yingwei Liu, Beijing (CN); Ke Wang, Beijing (CN); Qi Yao, Beijing (CN); Huijuan Wang, Beijing (CN); Haixu Li, Beijing (CN); Zhanfeng Cao, Beijing (CN); Guangcai Yuan, Beijing (CN); Xue Dong, Beijing (CN); Guoqiang Wang, Beijing (CN); and Zhijun Lv, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Apr. 21, 2023, as Appl. No. 18/137,857.
Application 18/137,857 is a continuation of application No. 16/765,530, granted, now 11,688,724, previously published as PCT/CN2019/089543, filed on May 31, 2019.
Prior Publication US 2023/0260982 A1, Aug. 17, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 24/13 (2013.01); H01L 27/124 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1319 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display backplate, comprising:
an array substrate and a plurality of pairs of connection structures on a surface of the array substrate; wherein
the array substrate comprises a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures, and the common electrode signal line is connected to another of the pair of the connection structures; and
the connection structure comprises at least one tip portion, an orthographic projection of the least one tip portion on the surface of the array substrate falls within an orthographic projection of a bottom of the connection structure on the surface, wherein the bottom of the connection structure is connected to the surface of the array substrate,
wherein the display backplate further comprises a base disposed on the surface of the array substrate, wherein the base comprises recesses in one-to-one correspondence with the connection structures, a shape of the recess is conformal to a shape of the connection structure, and the connection structure is inside the corresponding recess.