US 11,929,357 B2
Optoelectronic package structure and method of manufacturing the same
Jr-Wei Lin, Kaohsiung (TW); and Mei-Ju Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 20, 2021, as Appl. No. 17/506,462.
Prior Publication US 2023/0120036 A1, Apr. 20, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An optoelectronic package structure, comprising: a carrier comprising a first region and a second region adjacent to the first region; an electronic component disposed under the first region of the carrier; a photonic component disposed over the electronic component; a first power supply path in the carrier, wherein the first power supply path electrically connects the electronic component; a processing unit disposed over the second region, wherein the processing unit covers the second region from a top view perspective; and a second power supply path in the carrier and electrically connects the processing unit; wherein the processing unit is disposed adjacent to a first surface of the carrier, and the electronic component is disposed adjacent to a second surface of the carrier opposite to the first surface.