Kenji Sasaki, West Linn, OR (US); Kurt Ulmer, Vancouver, WA (US); Paul J. Schuele, Washougal, WA (US); and Jong-Jan Lee, Camas, WA (US)
Assigned to eLux, Inc., Vancouver, WA (US)
Filed by eLux Inc., Vancouver, WA (US)
Filed on Feb. 3, 2022, as Appl. No. 17/591,705.
Application 17/591,705 is a division of application No. 16/875,994, filed on May 16, 2020, granted, now 11,296,059.
Application 16/875,994 is a continuation in part of application No. 16/846,493, filed on Apr. 13, 2020, granted, now 11,251,166.
Application 16/846,493 is a continuation in part of application No. 16/727,186, filed on Dec. 26, 2019, granted, now 11,145,787.
Application 16/727,186 is a continuation of application No. 16/406,196, filed on May 8, 2019, granted, now 10,643,981.
Application 16/406,196 is a continuation in part of application No. 16/406,080, filed on May 8, 2019, granted, now 10,804,426.
Application 16/406,080 is a continuation in part of application No. 16/125,671, filed on Sep. 8, 2018, granted, now 10,516,084, issued on Dec. 24, 2019.
Application 16/125,671 is a continuation in part of application No. 15/838,536, filed on Dec. 12, 2017, granted, now 10,242,977, issued on Mar. 26, 2019.
Application 15/838,536 is a continuation in part of application No. 15/722,037, filed on Oct. 2, 2017, granted, now 10,543,486, issued on Jan. 28, 2020.
Application 15/722,037 is a continuation in part of application No. 15/691,976, filed on Aug. 31, 2017, granted, now 10,535,640, issued on Jan. 14, 2020.
Application 15/691,976 is a continuation in part of application No. 15/440,735, filed on Feb. 23, 2017, granted, now 10,381,335, issued on Aug. 13, 2019.
Application 15/440,735 is a continuation in part of application No. 15/416,882, filed on Jan. 26, 2017, granted, now 10,446,728, issued on Nov. 15, 2019.
Application 15/416,882 is a continuation in part of application No. 15/413,053, filed on Jan. 23, 2017, granted, now 10,520,769, issued on Dec. 31, 2019.
Application 15/413,053 is a continuation in part of application No. 15/412,731, filed on Jan. 23, 2017, granted, now 10,418,527, issued on Sep. 17, 2019.
Application 15/412,731 is a continuation in part of application No. 15/410,195, filed on Jan. 19, 2017, granted, now 10,236,279, issued on Mar. 19, 2019.
Application 15/410,195 is a continuation in part of application No. 15/410,001, filed on Jan. 19, 2017, granted, now 9,825,202, issued on Nov. 21, 2017.
Application 15/410,001 is a continuation in part of application No. 14/749,569, filed on Jun. 24, 2015, granted, now 9,722,145, issued on Aug. 1, 2017.
Application 14/749,569 is a continuation in part of application No. 15/221,571, filed on Jul. 27, 2016, granted, now 9,755,110, issued on Sep. 5, 2017.
Application 15/221,571 is a continuation in part of application No. 15/197,266, filed on Jun. 29, 2016, granted, now 10,249,599, issued on Apr. 2, 2019.
Application 15/410,001 is a continuation in part of application No. 15/190,813, filed on Jun. 23, 2016, granted, now 9,892,944, issued on Feb. 13, 2018.
Application 15/190,813 is a continuation in part of application No. 15/158,556, filed on May 18, 2016, granted, now 9,985,190, issued on May 29, 2018.
Application 15/158,556 is a continuation in part of application No. 15/266,796, filed on Sep. 15, 2016, granted, now 9,917,226, issued on Mar. 13, 2018.
Application 15/266,796 is a continuation in part of application No. 14/680,618, filed on Apr. 7, 2015, granted, now 10,115,862, issued on Oct. 30, 2018.
Application 14/680,618 is a continuation in part of application No. 14/530,230, filed on Oct. 31, 2014, abandoned.
Prior Publication US 2022/0157790 A1, May 19, 2022
1. A system for selectively segregating regions of a micro light emitting diode (microLED) carrier substrate, the system comprising:
a controller having an output to supply a first map of predetermined defect regions in the carrier substrate;
a printer having an input to accept the first map and a nozzle to apply a solvent-resistant binding material to selected regions of the carrier substrate in response to the first map; and;
wherein microLEDs in the selected regions remain attached to the carrier substrate despite exposure to an adhesive dissolving solvent.
