US 11,929,338 B2
Honeycomb pattern for conductive features
Shenggao Li, Cupertino, CA (US)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 14, 2023, as Appl. No. 18/300,862.
Application 18/300,862 is a continuation of application No. 17/363,968, filed on Jun. 30, 2021, granted, now 11,652,075.
Claims priority of provisional application 63/188,156, filed on May 13, 2021.
Prior Publication US 2023/0253357 A1, Aug. 10, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/17 (2013.01) [H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/17142 (2013.01); H01L 2224/17152 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a package component comprising:
a first plurality of electrical connectors at a surface of the package component, wherein the first plurality of electrical connectors are arranged as having a first honeycomb pattern;
a plurality of conductive paths; and
a second plurality of electrical connectors at the surface of the package component, wherein the second plurality of electrical connectors form a second honeycomb pattern, and wherein each of the plurality of conductive paths electrically connects one of the first plurality of electrical connectors to a corresponding one of the second plurality of electrical connectors.