US 11,929,331 B2
Routing structure
Chin-Shen Lin, Taipei (TW); Wan-Yu Lo, Taoyuan County (TW); Meng-Xiang Lee, Yunlin County (TW); Hao-Tien Kan, Hsinchu (TW); Kuo-Nan Yang, Hsinchu (TW); and Chung-Hsing Wang, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Dec. 19, 2022, as Appl. No. 18/067,728.
Application 18/067,728 is a continuation of application No. 16/911,343, filed on Jun. 24, 2020, granted, now 11,532,562.
Prior Publication US 2023/0121445 A1, Apr. 20, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H05K 1/02 (2006.01)
CPC H01L 23/5386 (2013.01) [H05K 1/0298 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A routing structure, comprising:
a substrate having a boundary; and
a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate;
wherein the first conductive trace is inclined with respect to the boundary of the substrate.