CPC H01L 23/5386 (2013.01) [H05K 1/0298 (2013.01)] | 20 Claims |
1. A routing structure, comprising:
a substrate having a boundary; and
a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate;
wherein the first conductive trace is inclined with respect to the boundary of the substrate.
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