CPC H01L 23/5226 (2013.01) [H01L 21/56 (2013.01); H01L 21/76873 (2013.01); H01L 23/3157 (2013.01); H01L 23/53238 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 24/09 (2013.01); H01L 24/14 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01)] | 20 Claims |
1. A method of forming an integrated fan-out package, comprising:
forming a seed layer over two dies and over an encapsulant between the two dies;
forming a first photoresist layer on the seed layer;
forming a first metal line by using the seed layer as a seed;
removing the first photoresist layer;
forming a second photoresist layer on the seed layer;
forming a plurality of first vias over the two dies by using the first metal line as a seed and forming a plurality of first dummy vias over the encapsulant by using the seed layer as a seed; and
removing the second photoresist layer.
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