CPC H01L 23/49568 (2013.01) [H01L 23/057 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 23/3121 (2013.01); H01L 23/49562 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/46 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/014 (2013.01)] | 19 Claims |
1. A radio frequency (RF) package, comprising:
a first RF power die having a die coefficient of thermal expansion (CTE);
a high thermal performance substrate, comprising:
a metallic base structure having a base structure CTE, a frontside facing the first RF power die, and a first die attach region on the frontside of the metallic base structure; and
a first CTE matched mount pad bonded to the metallic base structure and covering the first die attach region, the first CTE matched mount pad having a mount pad CTE greater than the die CTE and less than the base structure CTE;
an electrically-conductive bonding material attaching the first RF power die to the first CTE matched mount pad; and
RF circuitry integrated into first RF power die and electrically coupled to the metallic base structure through the first CTE matched mount pad.
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