US 11,929,310 B2
Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods
Lu Li, Gilbert, AZ (US); Lakshminarayan Viswanathan, Phoenix, AZ (US); and Freek Egbert van Straten, Mook (NL)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on Dec. 9, 2021, as Appl. No. 17/546,453.
Prior Publication US 2023/0187325 A1, Jun. 15, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/057 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/49568 (2013.01) [H01L 23/057 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 23/3121 (2013.01); H01L 23/49562 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/46 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/014 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A radio frequency (RF) package, comprising:
a first RF power die having a die coefficient of thermal expansion (CTE);
a high thermal performance substrate, comprising:
a metallic base structure having a base structure CTE, a frontside facing the first RF power die, and a first die attach region on the frontside of the metallic base structure; and
a first CTE matched mount pad bonded to the metallic base structure and covering the first die attach region, the first CTE matched mount pad having a mount pad CTE greater than the die CTE and less than the base structure CTE;
an electrically-conductive bonding material attaching the first RF power die to the first CTE matched mount pad; and
RF circuitry integrated into first RF power die and electrically coupled to the metallic base structure through the first CTE matched mount pad.