CPC H01L 23/053 (2013.01) [H01L 21/52 (2013.01); H01L 25/18 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a substrate;
a package structure disposed on the substrate; and
a lid structure disposed over substrate, wherein the lid structure comprises a main body covering and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure, wherein the plurality of rib portions are bonded to the substrate through an adhesive.
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