US 11,929,293 B2
Semiconductor package with lid structure
Tsung-Shu Lin, New Taipei (TW); Wensen Hung, Hsinchu County (TW); and Tsung-Yu Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 19, 2021, as Appl. No. 17/406,108.
Prior Publication US 2023/0059983 A1, Feb. 23, 2023
Int. Cl. H01L 23/053 (2006.01); H01L 21/52 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/053 (2013.01) [H01L 21/52 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a substrate;
a package structure disposed on the substrate; and
a lid structure disposed over substrate, wherein the lid structure comprises a main body covering and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure, wherein the plurality of rib portions are bonded to the substrate through an adhesive.