CPC H01L 21/561 (2013.01) [H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] | 20 Claims |
1. A method comprising:
forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate;
forming first connectors over the set of through-vias on a first side of the substrate;
singulating a first die from the substrate, the first die having a front side and a back side, the front side including the first connectors, the back side opposite the front side;
attaching the front side of the first die to a carrier, wherein after attaching the front side of the first die to the carrier, the front side of the first die has an interface with the carrier;
laterally encapsulating the first die in a first encapsulant;
thinning the back side of the first die to expose the set of through-vias;
forming second connectors over the set of through-vias on the back side of the first die;
bonding multiple device dies to the second connectors[[, wherein after cutting through the first encapsulant to singulate the first die and the device die into the package, the package comprises the multiple device dies]]; and
cutting through the first encapsulant to singulate the first die and the device die into a package;
wherein after cutting through the first encapsulant to singulate the first die and the device die into the package, the package comprises the multiple device dies.
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