US 11,929,260 B2
Low warpage curing methodology by inducing curvature
Fang Jie Lim, Singapore (SG); Chin Wei Tan, Singapore (SG); Jun-Liang Su, Singapore (SG); Felix Deng, Singapore (SG); Sai Kumar Kodumuri, Singapore (SG); Ananthkrishna Jupudi, Singapore (SG); and Nuno Yen-Chu Chen, Singapore (SG)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 24, 2021, as Appl. No. 17/410,958.
Prior Publication US 2023/0061379 A1, Mar. 2, 2023
Int. Cl. H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/56 (2013.01) [H01L 21/563 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 21/6838 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/75986 (2013.01); H01L 2224/83047 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83908 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for reducing warpage of a substrate, comprising:
applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool;
placing the substrate on a pedestal in a curing chamber, wherein the pedestal has a central region that is raised with respect to a peripheral region of the pedestal, and wherein the substrate has an expected post-cure deflection in a first direction;
inducing a curvature on the substrate in a direction opposite the first direction applying a force against the substrate to conform the substrate to the pedestal, wherein applying the force comprises placing a ring that is weighted on an outer about 1 to about 3 mm of the substrate; and
curing the substrate by heating the substrate in the curing chamber.