CPC H01L 21/56 (2013.01) [H01L 21/563 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 21/6838 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/75986 (2013.01); H01L 2224/83047 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83908 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/3511 (2013.01)] | 20 Claims |
1. A method for reducing warpage of a substrate, comprising:
applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool;
placing the substrate on a pedestal in a curing chamber, wherein the pedestal has a central region that is raised with respect to a peripheral region of the pedestal, and wherein the substrate has an expected post-cure deflection in a first direction;
inducing a curvature on the substrate in a direction opposite the first direction applying a force against the substrate to conform the substrate to the pedestal, wherein applying the force comprises placing a ring that is weighted on an outer about 1 to about 3 mm of the substrate; and
curing the substrate by heating the substrate in the curing chamber.
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