US 11,929,206 B2
Multilayer electronic component having improved high temperature load life and moisture resistance reliability
Dong Jun Jung, Suwon-si (KR); Yun Kim, Suwon-si (KR); Hyun Kim, Suwon-si (KR); Sim Chung Kang, Suwon-si (KR); and Eun Jung Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 16, 2021, as Appl. No. 17/476,995.
Claims priority of application No. 10-2021-0003969 (KR), filed on Jan. 12, 2021.
Prior Publication US 2022/0223344 A1, Jul. 14, 2022
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
side margin portions disposed on the fifth and sixth surfaces, respectively; and
external electrodes disposed on the third and fourth surfaces, respectively,
wherein the body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction and cover portions disposed on opposite end surfaces of the active portion in the first direction, respectively,
one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers,
the interface portion and one of the side margin portions include Sn,
a content of Sn included in the one of the side margin portions is higher than a content of Sn included in one of the cover portions, and
a content of Sn included in the one of the side margin portions in a region spaced apart from a boundary between the active portion and the one of the side margin portions outwardly of the one of the side margin portions by 1 μm is 0.2 at % or more and 1.0 at % or less.