US 11,929,200 B2
Coil component and board having the same mounted thereon
Dong Hwan Lee, Suwon-si (KR); Sang Soo Park, Suwon-si (KR); Chan Yoon, Suwon-si (KR); Dong Jin Lee, Suwon-si (KR); Hwi Dae Kim, Suwon-si (KR); and Hye Mi Yoo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 10, 2020, as Appl. No. 17/117,219.
Claims priority of application No. 10-2020-0115983 (KR), filed on Sep. 10, 2020.
Prior Publication US 2022/0076881 A1, Mar. 10, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/292 (2013.01) [H01F 17/0013 (2013.01); H01F 17/045 (2013.01); H01F 27/2804 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A coil component comprising:
a body including a support member having an upper surface and a lower surface;
first and second coil portions spaced apart from each other and each having an upper coil pattern on disposed on the upper surface of the support member and a lower coil pattern disposed on the lower surface of the support member;
first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and
first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion,
wherein the body has first and second cores spaced apart from each other, and
each of the upper coil pattern and the lower coil pattern of the first coil portion has a first winding portion wound around the first core and a first extended portion surrounding the first and second cores.