US 11,928,039 B1
Data-transfer test mode
Yang Lu, Boise, ID (US); Kang-Yong Kim, Boise, ID (US); Mark Kalei Hadrick, Boise, ID (US); and Keun Soo Song, Meridian, ID (US)
Assigned to Micron Technologies, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 1, 2022, as Appl. No. 18/051,603.
Int. Cl. G06F 11/27 (2006.01); G06F 7/76 (2006.01); G06F 11/30 (2006.01); G06F 13/00 (2006.01); G06F 13/14 (2006.01); G06F 13/28 (2006.01); G06F 21/85 (2013.01)
CPC G06F 11/27 (2013.01) [G06F 7/762 (2013.01); G06F 11/3041 (2013.01); G06F 13/00 (2013.01); G06F 13/14 (2013.01); G06F 13/28 (2013.01); G06F 21/85 (2013.01); G06F 2213/00 (2013.01); G06F 2213/0024 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a die comprising:
first pads; and
a second pad,
the die configured to:
be one of multiple dies that are interconnected using the first pads during an interconnected mode; and
prior to being connected to another die of the multiple dies:
operate in accordance with a data-transfer test mode; and
responsive to operating in accordance with the data-transfer test mode, transmit, using a second pad of the die, a chunk of a burst of write data intended to be transferred to the other die using the first pads in accordance with the interconnected mode.