US 11,927,604 B2
Multi-site concurrent wafer probe magnetic circuit testing
Xinkun Huang, McKinney, TX (US); Dok Won Lee, Mountain View, CA (US); Christopher Michael Ledbetter, Farmers Branch, TX (US); Bret Alan Dahl, McKinney, TX (US); and Roy Deidrick Solomon, Melissa, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 6, 2021, as Appl. No. 17/313,657.
Claims priority of provisional application 63/025,546, filed on May 15, 2020.
Prior Publication US 2021/0356497 A1, Nov. 18, 2021
Int. Cl. G01R 33/12 (2006.01); G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 33/07 (2006.01)
CPC G01R 1/07342 (2013.01) [G01R 1/0491 (2013.01); G01R 33/072 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic device, the method comprising:
initializing a wafer probe test system to test a wafer that is positioned in a wafer plane of orthogonal first and second directions, including:
measuring a probe needle height along a third direction that is orthogonal to the first and second directions, and
using a magnetic sensor of the wafer probe test system, measuring a magnetic field of a rotary magnet rotating about an axis along the third direction at different rotational angles; and
while the rotary magnet rotates, testing magnetic sensing performance of circuits of respective test sites of the wafer according to a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of the rotational angle of the rotary magnet, the probe needle height and measured magnetic flux density of the magnetic sensor.