US 11,927,436 B2
Measurement machine and method for detecting a defect in solder joints
Jaime E. Llinas, Houston, TX (US); Saravanan Rathakrishnan, Putrajaya (MY); Yanyan Xia, Shanghai (CN); ZeLin Wu, Shanghai (CN); Yanli Li, TianJin (CN); JunHui Li, Shanghai (CN); and Jian Miremadi, Sunnyvale, CA (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US)
Filed on Aug. 17, 2021, as Appl. No. 17/404,097.
Prior Publication US 2023/0059410 A1, Feb. 23, 2023
Int. Cl. G01B 15/00 (2006.01); G01B 9/04 (2006.01); G01B 11/02 (2006.01); G01N 21/956 (2006.01); G01B 21/04 (2006.01)
CPC G01B 15/00 (2013.01) [G01B 9/04 (2013.01); G01B 11/02 (2013.01); G01N 21/956 (2013.01); G01B 21/042 (2013.01); G01N 2021/95638 (2013.01); G01N 2021/95669 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
i) receiving, by a processing resource of a computing device, a first data representing side joint lengths of a plurality of solder joints measured by a first measurement machine, wherein the plurality of solder joints is formed between a solder lead in an electronic component and an electronic board;
ii) receiving, by the processing resource, a second data representing the side joint lengths of the plurality of solder joints measured by a second measurement machine;
iii) determining, by the processing resource, a correlation value based on a statistical analysis of a relationship between the first and second data; and
iv) updating, by the processing resource, an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first and second data, wherein the algorithm is used as a dimensional metrology in the first measurement machine to detect a defect among the plurality of solder joints.