US 11,927,400 B2
Method for fabricating vapor chamber
Jen-Chih Cheng, Taipei (TW); and Lei-Lei Liu, Taipei (TW)
Assigned to COOLER MASTER CO., LTD., Taipei (TW)
Filed by COOLER MASTER CO., LTD., Taipei (TW)
Filed on Apr. 13, 2023, as Appl. No. 18/134,526.
Application 18/134,526 is a division of application No. 16/837,125, filed on Apr. 1, 2020, abandoned.
Claims priority of application No. 201910528348.0 (CN), filed on Jun. 18, 2019.
Prior Publication US 2023/0251044 A1, Aug. 10, 2023
Int. Cl. F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 3/12 (2006.01); H05K 7/20 (2006.01)
CPC F28D 15/0283 (2013.01) [F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 3/12 (2013.01); H05K 7/20309 (2013.01); F28F 2240/00 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method for fabricating a vapor chamber, comprising:
positioning a capillary structure on a first cover;
forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover;
covering the first cover with the second cover;
positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance; and
pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.