US 11,926,695 B2
High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
Kyeong Pang, Suwon-si (KR); In Kim, Suwon-si (KR); Jonghoon Won, Yongin-si (KR); Mooho Lee, Suwon-si (KR); Hyejeong Lee, Suwon-si (KR); and Songwon Hyun, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 11, 2020, as Appl. No. 16/898,761.
Claims priority of application No. 10-2019-0146181 (KR), filed on Nov. 14, 2019.
Prior Publication US 2021/0147612 A1, May 20, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); C09D 5/00 (2006.01); C09D 163/00 (2006.01); C09K 5/14 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01)
CPC C08G 59/245 (2013.01) [C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); C09D 5/00 (2013.01); C09D 163/00 (2013.01); C09K 5/14 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An epoxy compound represented by Formula 1:
E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1
wherein, in Formula 1,
M1, M2, and M3 are each independently a mesogenic unit selected from compounds of Formula 2, and p, q, and r are each independently 0 or 1, wherein at least one of p, q, and r is 1;
L1, L2, and L3 are each independently —O—, —C(═O)O—, —O—C(═O)O—, —(CH2)2—C(═O)—, —CH═CH—C(═O)—, —S(═O)—, —CH═N—, —NHC(═O)O—, —C(═O)NH—, —OC(═O)NHS(═O)O—, or —CH2(C6H4)C(═O)—, and x, y, and z are each independently 0 or 1;
A is a spacer, and is a substituted or unsubstituted C1-C12 alkylene group, a substituted or unsubstituted C2-C12 alkenylene group, a substituted or unsubstituted C2-C12 alkynylene group, a substituted or unsubstituted C6-C12 arylene group, or a substituted or unsubstituted C4-C12 heteroarylene group; and
E1 and E2 are the same or different epoxy-containing group;

OG Complex Work Unit Chemistry
wherein, in Formula 2,
R1 to R12 are each independently a hydrogen atom, a halogen atom, C1-C30 alkyl group, C2-C30 alkenyl group, C2-C30 alkynyl group, C1-C30 alkoxy group, C2-C30 alkoxyalkyl group, C1-C30 heteroalkyl group, C6-C30 aryl group, C7-C30 arylalkyl group, C2-C30 heteroaryl group, C3-C30 heteroarylalkyl group, C2-C30 heteroaryloxy group, C3-C30 heteroaryloxyalkyl group, C6-C30 heteroarylalkyloxy group, a hydroxy group, a nitro group, a cyano group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxyl group or a salt thereof, a sulfonyl group, a sulfamoyl group, a sulfonic acid or a salt thereof, or a phosphoric acid or a salt thereof,
L4 of Formula 2-12 to 2-15 is —O—, —C(═O)O—, —O—C(═O)O—, —(CH2)2—C(═O)—, —CH═CH—C(═O)—, —S(═O)—, —CH═N—, —NHC(═O)O—, —C(═O)NH—, —OC(═O)NHS(═O)O—, or —CH2(C6H4)C(═O)—, and
X is N, P, or As, Y is O, S, or Se, and
n is an integer of 1 to 10; and
wherein
a segment M1p-L1x-M2q-L2y-M3r of Formula 1 has at least one group structure represented by Formula 3:

OG Complex Work Unit Chemistry
wherein, in Formula 3, n is an integer of 1 to 10, or
at least one group structure represented by Formula 4, where n of Formula 4 is an integer of 3 to 10;

OG Complex Work Unit Chemistry