US 11,926,565 B2
Glass and melt solder for the passivation of semiconductor components
Linda Johanna Bartelt, Landshut (DE); Antonio Trizzino, Schluchtern (DE); Julia Gold, Landshut (DE); Sabine Pichler-Wilhelm, Landshut (DE); Martin Letz, Mainz (DE); and Martun Hovhannisyan, Heusenstamm (DE)
Assigned to SCHOTT AG, Mainz (DE)
Filed by SCHOTT AG, Mainz (DE)
Filed on Mar. 21, 2023, as Appl. No. 18/187,384.
Application 18/187,384 is a division of application No. 17/201,060, filed on Mar. 15, 2021, granted, now 11,634,356.
Claims priority of application No. 10 2020 106 946.4 (DE), filed on Mar. 13, 2020.
Prior Publication US 2023/0219839 A1, Jul. 13, 2023
Int. Cl. C03C 8/14 (2006.01); C03C 3/093 (2006.01); C03C 8/04 (2006.01); H01L 23/31 (2006.01)
CPC C03C 8/14 (2013.01) [C03C 3/093 (2013.01); C03C 8/04 (2013.01); H01L 23/3171 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A glass powder comprising the following constituents in % by mole:
 
 
 
 SiO2 15.0 to 30.0
 
 Al2O3 0.0 to 8.0
 
 B2O3 14.0 to 25.0
 
 ZnO 43.0 to 65.0
 
 MgO 0.0 to 8.0
 
 
wherein the glass powder has a particle size distribution that is characterized by a spread (d90−d10)/d50 of at least 1.80 and at most 6.00,
wherein the glass powder has a mean particle size d50 of 1.0 μm to 10.0 μm,
wherein the volume portion of particles with sizes below 1.0 μm is limited to at most 30% by volume of the glass, and
wherein the sum of the contents of SiO2 and ZnO in the glass is at least 73.0% by mole.