US 11,925,963 B2
Method for treating a substrate
Kyeong Min Lee, Hwaseong-si (KR); Tae-Keun Kim, Suwon-si (KR); Min Hee Cho, Suwon-si (KR); and Won Young Kang, Gimhae-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on May 27, 2022, as Appl. No. 17/826,729.
Prior Publication US 2023/0405645 A1, Dec. 21, 2023
Int. Cl. B08B 7/00 (2006.01); B08B 3/10 (2006.01)
CPC B08B 7/0014 (2013.01) [B08B 3/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate treating method comprising:
supplying a dissolution solution onto a rotating substrate; and
supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film,
wherein the dissolution solution is provided at a boiling temperature of the dissolution solution.