US 12,250,825 B2
Integrated assemblies and methods of forming integrated assemblies
Durai Vishak Nirmal Ramaswamy, Boise, ID (US); Marcello Mariani, Milan (IT); and Giorgio Servalli, Fara Gera d'Adda (IT)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 1, 2024, as Appl. No. 18/429,677.
Application 18/429,677 is a continuation of application No. 17/381,040, filed on Jul. 20, 2021, granted, now 11,917,834.
Prior Publication US 2024/0215258 A1, Jun. 27, 2024
Int. Cl. H10B 53/50 (2023.01); G11C 11/22 (2006.01); H10B 53/10 (2023.01); H10B 53/30 (2023.01); H10B 53/40 (2023.01)
CPC H10B 53/50 (2023.02) [G11C 11/221 (2013.01); H10B 53/10 (2023.02); H10B 53/30 (2023.02); H10B 53/40 (2023.02)] 14 Claims
OG exemplary drawing
 
1. An integrated assembly, comprising:
a bottom electrode;
a planar structure comprising top-electrode-material spaced over the bottom electrode; and
a leaker device extending from the bottom electrode to the top-electrode-material.