US 12,250,798 B2
Electronic device including heat dissipation sheet
Haein Chung, Suwon-si (KR); Kyungha Koo, Suwon-si (KR); Kangsik Kim, Suwon-si (KR); and Wonmin Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 27, 2022, as Appl. No. 17/975,169.
Application 17/975,169 is a continuation of application No. PCT/KR2021/004854, filed on Apr. 19, 2021.
Claims priority of application No. 10-2020-0052299 (KR), filed on Apr. 29, 2020.
Prior Publication US 2023/0039881 A1, Feb. 9, 2023
Int. Cl. H05K 7/20 (2006.01); F16F 15/04 (2006.01); H04M 1/02 (2006.01)
CPC H05K 7/20963 (2013.01) [F16F 15/04 (2013.01); H04M 1/026 (2013.01); F16F 2224/0225 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first electrical element;
a heat dissipation sheet comprising a heat diffusion member and an anti-shock member disposed to be stacked with at least a portion of the heat diffusion member; and
a bracket providing a space for receiving the heat dissipation sheet, the bracket including a first area corresponding to the first electrical element, a second area spaced apart from the first area and spaced apart from the first electrical element, and a third area disposed between the first area and the second area,
wherein in the first area, a first diffusion portion of the heat diffusion member is disposed to face in a first direction toward the first electrical element, and a first member of the anti-shock member is disposed to face in a second direction opposite to the first direction,
wherein in the second area, a second diffusion portion of the heat diffusion member is disposed to face in the second direction, and a second member of the anti-shock member is disposed to face in the first direction, and
wherein a third diffusion portion of the heat diffusion member disposed in the third area extends from the heat diffusion member in the first area and connects to the heat diffusion member in the second area.