US 12,250,794 B2
Modular data center
Nicholaus Ray Lancaster, Albany, NY (US); and Dipul Patel, Albany, NY (US)
Assigned to Soluna Holdings, Inc., Albany, NY (US)
Filed by Soluna Holdings, Inc., Albany, NY (US)
Filed on Mar. 28, 2024, as Appl. No. 18/620,807.
Application 18/620,807 is a continuation of application No. 17/867,315, filed on Jul. 18, 2022, granted, now 11,974,415.
Claims priority of provisional application 63/223,275, filed on Jul. 19, 2021.
Prior Publication US 2024/0244799 A1, Jul. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20745 (2013.01) [G06F 1/20 (2013.01); H05K 7/20145 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A data center configured to be positioned in an environment, the data center comprising:
a plurality of modules, each module comprising:
a housing configured to contain a plurality of processing devices that generate heat during operation, and
an air mover,
each module comprising an air inlet positioned on a first side of the housing and configured to receive air from the environment, each module also having an air outlet positioned on a second side of the housing configured to exhaust air from the housing using the air mover,
at least three modules of the plurality of modules spaced apart to form lateral spaces between adjacent modules, the plurality of modules forming an interior region configured to receive the exhausted air of the at least three modules,
each air mover being configured to generate a pressure differential between a top portion of the interior region and a bottom portion of the interior region using the exhausted air,
the lateral spaces being configured to reduce the pressure differential between the top portion of the interior region and the bottom portion of the interior region.