US 12,250,793 B2
Mobile terminal
Siqiang Sun, Shanghai (CN); Yameng Wei, Shenzhen (CN); and Xiyong Xu, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOIGES CO., LTD., Shenzhen (CN)
Appl. No. 17/920,519
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
PCT Filed Mar. 24, 2021, PCT No. PCT/CN2021/082500
§ 371(c)(1), (2) Date Oct. 21, 2022,
PCT Pub. No. WO2021/213118, PCT Pub. Date Oct. 28, 2021.
Claims priority of application No. 202010328027.9 (CN), filed on Apr. 23, 2020.
Prior Publication US 2023/0200021 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/205 (2013.01) 20 Claims
OG exemplary drawing
 
1. A mobile terminal comprising:
a housing;
a main board;
a heat generation element disposed on the main board;
a heat dissipation layer in contact with the heat generation element;
a first support in contact with the heat dissipation layer opposite the heat generation element, wherein the first support comprises a first groove; and
a second support affixed to a side of the heat dissipation layer that is opposite the heat generation element and comprising:
a third surface that faces the heat dissipation layer;
a fourth surface that faces away from the heat dissipation layer;
a second groove disposed on either the third surface or the fourth surface; and
a thermally conductive material disposed in the second groove,
wherein the main board, the heat generation element, the heat dissipation layer, and the first support are sequentially stacked in a plane parallel to a surface of the housing,
wherein the heat generation element is smaller in area than the first support,
wherein the heat generation element overlaps the first support, and
wherein the heat dissipation layer is larger in area than the heat generation element.